Omnisys enters multilayer FP7 project

Multilayer is a joint research program with 20 participating universities, institutes and companies from 7 European countries. The project overall objective is to develop and explore the potential of a new platform for the large-scale production of non-silicon, multimaterial micro devices based on a technology called ”Rolled multi material layered 3D shaping technology” and using the concept of tape casting and advanced printing techniques. Omnisys main role in the project is to design, test and evaluate THz components for assessing the technology with respect to THz sensor applications.